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SystemC is a system-level modeling language that offers a wide range of features to describe concurrent systems at different levels of abstraction. The SystemC standard permits simulators to implement a deterministic scheduling policy, which often...
Concept-based partitioning for large multidomain multifunctional embedded systems
Waseem Ahmed, Douglas Myers
Article No.: 22
Hardware-software partitioning is an important phase in embedded systems. Decisions made during this phase impact the quality, cost, performance, and the delivery date of the final product. Over the past decade or more, various partitioning...
Low-power TinyOS tuned processor platform for wireless sensor network motes
R. K. Raval, C. H. Fernandez, C. J. Bleakley
Article No.: 23
In this article we describe a low-power processor platform for use in Wireless Sensor Network (WSN) nodes (motes). WSN motes are small, battery-powered devices comprised of a processor, sensors, and a radio frequency transceiver. It is expected...
Register file partitioning and recompilation for register file power reduction
Xuan Guan, Yunsi Fei
Article No.: 24
Register files in modern embedded processors contribute a substantial budget in the energy consumption due to their large switching capacitance and long working time. For some embedded processors, on average 25% of registers account for...
On-chip sensor-driven efficient thermal profile estimation algorithms
Yufu Zhang, Ankur Srivastava, Mohamed Zahran
Article No.: 25
This article addresses the problem of chip-level thermal profile estimation using runtime temperature sensor readings. We address the challenges of: (a) availability of only a few thermal sensors with constrained locations (sensors cannot be...
Logic synthesis and circuit customization using extensive external don't-cares
Kai-Hui Chang, Valeria Bertacco, Igor L. Markov, Alan Mishchenko
Article No.: 26
Traditional digital circuit synthesis flows start from an HDL behavioral definition and assume that circuit functions are almost completely defined, making don't-care conditions rare. However, recent design methodologies do not always satisfy...
Off-chip substrate routing for high-density packages is challenging due to requirements such as high density, lack of vertical detour, non-Manhattan routing, and primarily planar routing. The existing substrate routing algorithms often result in a...